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Department of Engineering |
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University of Cambridge > Engineering Department > MMD |
Principal Investigator:
Michael Sutcliffe
Project Details:
MEMS devices are being realised in a wide range of applications. However there are serious
concerns about manufacturing routes for such devices. MEMS technology requires planarization and
polishing of a variety of material so that chemical-mechanical polishing (CMP) and subsequent
bonding are becoming significant MEMS processes. CMP works through the chemically-assisted wear of
the wafer surface by slurry particle and pad contact. There are several aspects of the mechanics
of this process that are tribologically counter-intuitive, and which this project will address.
Hydrodynamic effects due to the texture of the polishing mat interact with macroscopic 'wedge'
effects to generate pressure distributions across the wafer so that establishing the separation of
the wafer from the polishing medium is not straightforward. An important application of CMP has
been to produce "flat" surfaces sufficient to enable wafer bonding. Enough surface-to-surface
contact has been achieved for some locations on the wafer and for large enough structures for
bonding to be demonstrated. Because CMP does not achieve "flatness" across entire chips or
uniformly across the entire wafer, serious concerns remain.
Background Required:
Applicants should have a 1st or 2.1 in Engineering or a related subject.
Funding Source:
An EPSRC CASE Studentship is likely to be available for UK students, otherwise must be self-funded. Some "top-up" funding may be available.
Research Groups Involved:
Application Deadline:
Open
For further information and to apply contact:
Dr. M. P. F. Sutcliffe Cambridge University Engineering Dept Trumpington Street Cambridge, CB2 1PZ United Kingdom |
Phone: +44 (0)1223 332996 Fax: +44 (0)1223 332662 email: mpfs@eng.cam.ac.uk |
Initial letters of application and CVs should be sent to Dr. Sutcliffe.
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