Paper Submission & Publication

A particular qualification to participate in this Meeting will be the existence of strong connections between experienced engineers and scientists on an international stage. They must all have a shared interest in the application of materials science and mechanics at the various levels of size to identifiable small-scale structures on the one hand and in the use of analytical and numerical methods to compute the macroscopic response of the component or large-scale structure on the other.

An application to attend and submission of a papercan be made by any interested individual at any time.

A submitted paper must fall within the scope of the Meeting and fulfil its objectives.

The author should state the particular theme that the submitted paper addresses. A paper can be submitted at any time but no later than 26th January 2007. Outline papers only should be submitted in the first instance and cover no more than two sides of A4 paper. Applications to present a paper or to attend only must be made by electronic mail. Faxed applications and submission of outline papers are not accepted. Electronic submissions should be sent as an attachment to the email addressed to Dr Peter W R Beaumont. When submitting electronically, the outline paper should be sent either as a Word or a pdf file.

Applications to participate and outlines of submitted papers will be assessed by the Conference Advisory Panel. By 15th February 2007, papers will have been chosen that best match the criteria and fulfil the objectives of the Meeting.

Submitted papers will be judged primarily against the following criteria:

•  Relevance to the objectives, themes and focus of the Conference;

•  Potential impact in the scientific community;

•  Contribution to building a capability in composite materials modelling;

•  Scientific/Technical Quality of the proposed paper;

•  Relevance to those attending.

Papers will be published, if the author wishes, as full length papers in a special issue of the Journal of Materials Science by Springer, a leading international publisher.